•  
  •  
 

Journal of Metals, Materials and Minerals

Publication Date

2023

Abstract

Tape automated bonding (TAB) process plays a key role in the production of disk drives, microchips and other microelectronics components. Such tools should sustain their structures and properties throughout ultrasonic operation and are expected to last until reaching the targeted numbers of TAB cycles. This project aims to evaluate the changes in microstructures and physical properties of the bonding tools under ultrasonic service. Three commercial waffle-type tools from different suppliers were focused, namely Tool A, Tool B and Tool C. They provide different levels of bonding efficiency up to 50k cycles under relatively similar ultrasonic practice. Non-destructive and destructive testing methods were examined by the means of X-Ray and mass spectroscopy techniques, respectively. The waffle-end tips of the selected tool were observed using a confocal microscope. The changes in grain size and grain size distribution before and after ultrasonic service were quantitatively analyzed via electron micrographs. Also, their bulk density, hardness and toughness were determined. The experimental work revealed the variation in microstructural features and properties among the three, leading to the difference in ultrasonic efficiency, even they all contained similar phase composition. The relationship between microstructures, properties and ultrasonic efficiency was also reported and discussed.

DOI

10.55713/jmmm.v33i3.1709

First Page

-

Last Page

-

Download

Share

COinS
 
 

To view the content in your browser, please download Adobe Reader or, alternately,
you may Download the file to your hard drive.

NOTE: The latest versions of Adobe Reader do not support viewing PDF files within Firefox on Mac OS and if you are using a modern (Intel) Mac, there is no official plugin for viewing PDF files within the browser window.