Soldering of copper using graphene-phosphoric acid gel

Authors

Gurudatt Puranik
Asis Sarkar
Nirankar Mishra
Sangam Chandrasekhar Gurumurthy
Shridhar Mundinamani

Publication Date

2020-12-01

Abstract

Soldering is a physical process in which one metal melts and joins the other to form a strong bond,which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-stepsoldering of copper wire on to the surface of the copper-based printed circuit board. The soldering fluxcan be applied to the copper, and wire can be soldered in ambient conditions using commercial solderingiron at a standard soldering temperature of 260°C. This flux helps the formation of strong and electricallyconducting joints between the copper wire and copper-based printed circuit board. The joints arestudied with scanning electron microscope images, and energy dispersive X-ray mapping successfullyshows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.

First Page

60

Last Page

67

Recommended Citation

Puranik, Gurudatt; Sarkar, Asis; Mishra, Nirankar; Gurumurthy, Sangam Chandrasekhar; and Mundinamani, Shridhar (2020) "Soldering of copper using graphene-phosphoric acid gel," Journal of Metals, Materials and Minerals: Vol. 30: No. 4, Article 7.
Available at: https://digital.car.chula.ac.th/jmmm/vol30/iss4/7